Maro Publications

Circuit Boards

Patents with Abstracts

*9/25/2012

Maro Topics

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Patents with Abstracts

6. 8,272,126 
Method of producing circuit board
 
Yoshioka and Fujiwara of the Panasonic a developed a circuit board that allows highly accurate preservation of the circuit profile and gives a circuit having a desired depth in preparation of a fine circuit by additive process.  This includes a film-forming step of forming a swellable resin film on the surface of an insulative substrate, a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the swellable resin film on the external surface of the swellable resin film, a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves and the surface of the swellable resin film, a film-separating step of swelling the swellable resin film with a particular liquid and then separating the swollen resin film from the insulative substrate surface, and a plating processing step of forming an electrolessly plated film only in the region where the plating catalyst or the plating catalyst formed from the plating catalyst precursor remains unseparated after separation of the swellable resin film. (RDC 9/25/2012)

5. 8,258,216 
Thermosetting resin compositions and articles
 
Qiang et al of  Park Electrochemical Corporation, New York, developed a resin composition, a cured resin, a sheet-like cured resin, a laminated body, a prepreg, electronic parts, single and multilayer circuit boards comprising a cyanate ester polymer and condensed phosphate ester, for use in single and multilayer circuit boards that are especially useful in the high-frequency range of above 100 MHz. (RDC 9/19/2012)

4. 8,230,891 
Manufacturing method of boards, mold-releasing sheet, manufacturing apparatus for board
 
Kishimoto, Takenaka and  Hiraishi of Panasonic Corporation, Japan, developed a method of circuit boards by laminating a prepreg as a lamination layer.  This laminating consists of heating and pressing the prepreg at given places by a heating means via a mold releasing sheet; removing the pressing and heating; cooling the prepreg; and peeling off the mold releasing sheet. The foregoing manufacturing method allows placing the prepreg over a metal foil or a board, or the prepreg over a preprag, and fixing the placed-over unit at given places, so that double sides boards or multi-layer boards are laminated each other accurately. (RDC 8/2/2012)

3. 8,230,575 
Overmolded circuit board and method
 
Veentra, Mulder and Fleischmann  of Innotec Corporation, Michigan, developed a circuit board  encapsulated in a thermoplastic polymer material. The device may be fabricated by at least partially shielding the electrical components with polymer material, followed by overmolding the polymer material with thermoplastic polymer material. The shielding material may comprise a pre-formed component, or it may comprise thermoplastic polymer material that is molded around the electrical components in a first molding step or "shot".  (RDC 8/1/2012)

2. 8,217,099 
Thermosetting resin composition
 
He and Su of ITEQ (Dongguan) Corporation, China, and ITEQ Corporation, Taiwan, developed an epoxy for circuit boards consisting of (1) 1.75 to  18 wt% epoxide resin able to copolymerize with bismaleimide, (2) 0.15 to 12.5 wt%  bismaleimide; (3) the free-radical initiator, (4) the inhibitor, its usage is a half of to double amount of initiator by mole; (5) 17.5 to 47 wt%  styrene-maleic anhydride low polymer with the molecular weight range of 1400-50000, (6) 20 to 60 wt% filler (7) 20 to 50 wt% solvent and (8) a flame retardant, which is able to be used in copper-clad panel industry. (RDC 7/27/2012)

1. 8,216,503 
Method for manufacturing printed circuit board using imprinting
 
Cho et al of Samsung Electro-Mechanics Co., Ltd. South Korea, produced a printed circuit board, in which an oxidant capable of polymerizing conductive polymers is selectively marked on a board using imprinting, and the monomer of a conductive polymer is filled in the selected pattern and polymerized, to provide a conductive polymer wiring pattern. With the method for manufacturing a printed circuit board, a printed circuit board can be given finer wiring widths to allow a highly integrated, highly efficient printed circuit board.  Thus, a printed circuit board (PCB) or a flexible printed circuit boards (FPCB) can be manufactured that is applicable to industrial, clerical, and domestic electric electronic products, by forming conductive polymer wiring using imprinting. (RDC 7/25/2012)

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Interested!!
Bookmark this page to follow future developments!.
(RDC 6/5/2012)

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Roger D. Corneliussen
Editor
www.maropolymeronline.com

Maro Polymer Links
Tel: 610 363 9920
Fax: 610 363 9921
E-Mail: cornelrd@bee.net  

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Copyright 2012 by Roger D. Corneliussen.
No part of this transmission is to be duplicated in any manner or forwarded by electronic mail without the express written permission of Roger D. Corneliussen
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** Date of latest addition; date of first entry is 6/27/2012.