Maro Publications

Electronic Packaging

Patent Titles

*11/21/2013 
from 4/15/2013

Maro Encyclopedia

xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx 

Patent Titles

11/5/2013

7. 8,574,696 
Electronic device housing assembly 

6. 8,574,682 
Housing and method for making same 

10/29/2013

5. 8,569,180 
Method and structure of wafer level encapsulation of integrated circuits with cavity 

3/19/2013

4. 8,399,985 
Mold design and semiconductor package 

3. 8,399,984 
Semiconductor package 

2. 8,399,977 
Resin-sealed package and method of producing the same 

1. 8,399,976 
Resin sealed semiconductor device and manufacturing method therefor 

xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx 

Interested!!
Bookmark this page to follow future developments!.
(RDC 6/5/2012)

xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx 

Roger D. Corneliussen
Editor
www.maropolymeronline.com

Maro Polymer Links
Tel: 610 363 9920
Fax: 610 363 9921
E-Mail: cornelrd@bee.net  

***********************************

Copyright 2013 by Roger D. Corneliussen.
No part of this transmission is to be duplicated in any manner or forwarded by electronic mail without the express written permission of Roger D. Corneliussen
**************************************

** Date of latest addition; date of first entry is 4/15/2013.