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Encapsulation

Patent Abstracts

From 08/11/2014 thorough 12/14/2011

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Patent Abstracts

5. 8,512,870 
Transparent resin for encapsulation material and electronic device including the same

A light emitting element such as a light emitting diode (LED), an organic light emitting diode (OLED) device, a photoluminescent (PL) device, and the like may be used in diverse areas, such as a domestic electric device, a lighting device, a display device, various automatic devices, and the like.

Shin et al of Cheil Industries, South Korea,  developed a transparent resin for an encapsulating LEDs based on a polymetallosiloxane from at least metal compounds. 

(RDC 8/26/2013)

4. 8,367,109 
Microbes encapsulated within crosslinkable polymers 

Chidambaram et al of Brookhaven Science Associates, LLC and  the State University of New York, New York, developed porous films consisting of crosslinked electrospun hydrogel fibers. Viable microbes are encapsulated within the crosslinked electrospun hydrogel fibers. The crosslinked electrospun hydrogel fibers are water insoluble and permeable. In this method a) forming a water mixture of microbes and a water soluble, crosslinkable polymer capable of forming a hydrogel (b) electrospinning the mixture to form electrospun fibers containing the microbes and (c) crosslinking the electrospun fibers  The fibers contain viable microbes.  The encapsulated microbes are viable and are capable of electron generation or utilization. Such electrodes are useful, for example, in microbial fuel cells and waste water treatment. The crosslinked electrospun hydrogel fibers are water insoluble and permeable. (RDC 2/14/2013)

3. 8,193,091 
Resin encapsulated semiconductor device and method for manufacturing the same
 
|Kawai et al of Panasonic, Japan, developed a die pad; signal leads, ground connection leads connected to the die pad; a semiconductor chip including electrode pads for grounding; metal thin wires, and an encapsulating resin for encapsulating the die pad and the semiconductor chip and encapsulating the signal leads and the ground connection lead such that lower portions of the signal leads and the ground connection lead are exposed as external terminals. The ground connection lead is connected to the electrode pad for grounding, so that the resin-encapsulated semiconductor device is electrically stabilized. Furthermore, interference between high frequency signals passing through the signal leads can be suppressed by the die pad and the ground connection leads. (RDC 6/26/2012)

2. 8,133,957 
Resin composition for encapsulating optical semiconductor element
 
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Hamamoto et al of Shin-Etsu Chemical, Japan, developed a material  for encapsulating an optical semiconductor consisting of  (A), (B) and (C) : (A) a branched silicone resin containing 2 to 6 epoxy groups, one or more (RSiO3/2) units, two or more (R2R3SiO)n structures and 3 or more (R 43-xR 5.xSiO1/2) units per molecule, in an amount of 100 parts by weight, wherein R1, R2, R3, R4 and R5 each represents a hydrogen atom, a hydroxyl group or a monovalent organic group of 1 to 20 carbon atoms which monovalent organic group may or may not contain an oxygen atom, provided that at least two of the R 5 groups within each molecule represent an epoxy group and/or an epoxy group-containing non-aromatic group, n represents an integer of 3 to 20, and x represents an integer of 1 to 3, (B) a curing agent, in such an amount that a content of epoxy reactive groups in the component (B) ranges from 0.4 to 1.5 moles per 1 mol of epoxy groups within component (A), and (C) a curing catalyst, in an amount within a range from 0.01 to 3 parts by weight per 100 parts by weight of a combination of component (A) and component (B). (RDC 5/4/2012)

1. 8,070,466
Seamless Capsule Manufacturing Apparatus

Takei and Nago of the Freund Corporation, Japan, developed aseamless capsule manufacturing device that ejects a droplet from a nozzle into hardening liquid to manufacture a seamless capsule.  Synthetic resin tubes are  flexible sections between pumps and the nozzle. The vibration caused by the pumps is absorbed in the flexible sections and thus is not transmitted to the nozzle, whereby eyes or the like of the seamless capsule caused by vibration noises can be suppressed. (RDC 12/14/2011 xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx 

Roger D. Corneliussen
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Copyright 2012 by Roger D. Corneliussen.
No part of this transmission is to be duplicated in any manner or forwarded by electronic mail without the express written permission of Roger D. Corneliussen
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** Date of latest addition; date of first entry is 12/14/2011.