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Epoxy Materials

Patent Abstracts

*10/4//2012

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Patent Abstracts

17.  8,277,679 
Composite magnetic material and magnetic element
 
Nakamura and Watanabe of Sumida Corporation, Japan, formed a magnetic composite with well-balanced magnetic and chemical properties.consisting of an epoxy binder and a magnetic powder containing 0.25 to 3 wt % Mn, 1 to 7 wt % Si, 2 to 8 wt % Cr, and the rest Fe.  5% of the powder particles having the major/minor axis greater than 2. (RDC 10/4/2012)

16. 8,242,216 
Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications
 
Matayabas, Jr. and Chen of Intel Corporation, California, formed an apoxy material using a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride. (RDC 8/30/2012)

15. 8,231,820 
Epoxy resin composition
 
Dixit et al of Aditya Birla Chemicals, Thailand, developed a molded composite by reacting a reaction mass containing a  20 to 50 wt% polyepoxide,  10 to 20 wt% diol, , 20 to 50 wt% hardener and  0.5 to 10 wt% accelerator either alone or in solution with compatible diluents, to obtain an epoxy resin mix having intrinsic viscosity in the range of 100 to 850 cPs.  This mixture is poured into a mold having an in-situ glass fiber scaffold at 45 to 50 C. and applying pressure to the resin mix in the mold to form a compressed green composition: partially curing the compressed green composition at a temperature in the range of 60 to 80 C,  This is further cured at 80 to 90 C.  The composite is used for structural applications like windmill blades, yachts, domes, ships made from a composite made in accordance with the process as mentioned herein. (RDC 8/7/2012)

14. 8,217,099 
Thermosetting resin composition
 
He and Su of ITEQ (Dongguan) Corporation, China, and ITEQ Corporation, Taiwan, developed an epoxy for circuit boards consisting of (1) 1.75 to  18 wt% epoxide resin able to copolymerize with bismaleimide, (2) 0.15 to 12.5 wt%  bismaleimide; (3) the free-radical initiator, (4) the inhibitor, its usage is a half of to double amount of initiator by mole; (5) 17.5 to 47 wt%  styrene-maleic anhydride low polymer with the molecular weight range of 1400-50000, (6) 20 to 60 wt% filler (7) 20 to 50 wt% solvent and (8) a flame retardant, which is able to be used in copper-clad panel industry. (RDC 7/27/2012)

13. 8,211,537 
Resin composition, and prepreg
 
Yokoe et al of Toho Tenax Co., Japan, developed a prepreg containing 100 parts by mass of a component (A) which is an epoxy resin; 41 to 80 parts by mass of a component (B) which is thermoplastic resin particles; and 20 to 50 parts by mass (in terms of diaminodiphenylsulfone) of a component (C) which is diaminodiphenylsulfone microencapsulated with a coating agent.  The thermoplastic resin particles (B) comprise at least thermoplastic resin particles (B1) having an average particle diameter of 1 to 50 .mu.m and thermoplastic resin particles (B2) having an average particle diameter of 2 to 100 .mu.m at a mass ratio of 3:1 to 1:3. The average particle diameter ratio D2/D1 of the average particle diameter D2 of the thermoplastic resin particles (B2) to the average particle diameter D1 of the thermoplastic resin particles (B1) is 2 or more. (RDC 7/9/2012)

12. 8,211,519 
Composition for forming gas-barrier material, gas-barrier material, a method of producing the same, and gas-barrier packing material
 
Obu et al of Toyo Seikan Kaisha, Ltd. and Kansai Paint Co., Ltd., Japan, developed a gas-barrier material, consisting of a polycarboxylic acid-type polymer (A) and a bifunctional alicyclic epoxy compound (B). The composition for forming a gas-barrier material features excellent gas-barrier property, retort resistance and flexibility, can be cured at a low temperature in a short period of time without affecting the plastic base material, and contributes to improving the productivity. (RDC 7/9/2012)

11. 8,193,258 
Sealant composition
 
Jeeng et al of the Industrial Technology Research Institute, Taiwan, develop a sealant consisting of (a) an oligomer including an unsaturated mono-carboxylic acid modified bisphenol A epoxy resin and an unsaturated mono-carboxylic acid modified bisphenol F epoxy resin, wherein an equivalence ratio of the bisphenol A epoxy resin to the bisphenol F epoxy resin is 0.05:0.95 to 0.3:0.7, the bisphenol A epoxy resin has a melting point higher than 40.degree. C. and the bisphenol F epoxy resin has a melting point lower than 40.degree. C.; (b) an epoxy resin having at least two or more than two epoxy groups; and (c) a photoinitiator. (RDC 6/26/2012)

10. 8,188,165 
Fire-retardant low-density epoxy composition
 
Elgimiabi and Lamon of 3M, Minnesota, developed  a curable precursor of a fire-retardant, low-density and essentially halogen-free epoxy composition consisting of (i) 10 to 70 weight percent of at least one organic epoxide compound with an epoxide functionality of at least one, (ii) 1 to 55 weight percent of at least one epoxide hardener, (iii) 5 to 50 weight percent of an essentially halogen-free fire-retardant system that includes a mixture of: (1) at least one compound selected from the group comprising alkaline earth metal hydroxides and aluminium group hydroxides, and (2) at least one phosphorous-containing material, (iv) 10 to 60 weight percent of a filler system capable of reducing the density of the precursor that includes a mixture of (1) at least one low-density inorganic filler having a density of between 0.1 to 0.5 g cm3, (2) at least one low-density organic filler having a density of between 0.01 to 0.30 g/cm3 and being compressible.  (RDC 6/7/2012)

9. 8,187,703 
Fiber-reinforced polymer composites containing functionalized carbon nanotubes
 
Zhu et al of Rice University, Texas, integrated carbon nanotubes into epoxy polymer composites via chemical functionalization of carbon nanotubes.  Integration is enhanced through improved dispersion and/or covalent bonding with the epoxy matrix during the curing process.  In general, such methods involve the attachment of chemical moieties (i.e., functional groups) to the sidewall and/or end-cap of carbon nanotubes such that the chemical moieties react with either the epoxy precursor(s) or the curing agent(s) (or both) during the curing process. Additionally, in some embodiments, these or additional chemical moieties can function to facilitate dispersion of the carbon nanotubes by decreasing the van der Waals attractive forces between the nanotubes. (RDC 6/7/2012)

8. 8,187,702 
Decorative laminate and method of making
 
O'Brien and Taillan of The Diller Corporation, Ohio, developed a  decorative laminate is provided and includes a core with at least one epoxy resin impregnated fiberboard sheet. The decorative laminate also includes at least one decorative layer provided adjacent to the core. A method of forming a decorative laminate is also provided. (RDC 6/7/2012)

7. 8,178,599 
Composition of epoxy resin, spherical alumina, ultrafine silica polyorganosiloxane and phenolic resin
 
Osuga of Sumitomo Bakelite Company, Japan, developed an epoxy which is excellent in flash characteristics and thermal conductivity, and gives an area mounting type semiconductor apparatus having little warpage and excellent temperature cycle properties.  This epoxy contains (A) a spherical alumina, (B) an ultrafine silica having a specific surface area of 120-280 m.sup.2/g, (C) a silicone compound, (D) an epoxy resin, (E) a phenolic resin as a curing agent, and (F) a curing accelerator, in which said ultrafine silica is contained in an amount of 0.2-0.8% by weight based on the total weight of the resin composition, and said silicone compound is a polyorganosiloxane and is contained in an amount of 0.3-2.0% by weight based on the total weight of the resin composition. (RDC 5/29/2012)

6. 8,137,786 
Epoxy resin composition for fiber-reinforced composite material
 
Kousaka et al of Yokohama Rubber, Japan, developed a toughened epoxy resin for a prepreg for a face sheet of a honeycomb panel. This resin consists of: an epoxy resin (A); a thermoplastic resin (B); fine solid resin particles (C); and a curing agent (D) in which the epoxy resin after being cured has a morphology in which the epoxy resin (A) and the thermoplastic resin (B) form co-continuous phases, and the fine solid resin particles (C) are dispersed in at least the continuous phase of the epoxy resin (A) in the co-continuous phases. (RDC 5/15/2012)

5. 8,133,929 
Method for incorporating long glass fibers into epoxy-based reinforcing

Hoefflin, Heidtman and Medaris of Sika Technology, Switzerland, developed an epoxy sealant based on coating glass reinforcing fibers with a molten epoxy-based composition. The glass fiber reinforced material can then be formed into a preform suitable for injection molding into an expandable sealing baffle.  (RDC 5/3/2012)

4. 8,062,750
Epoxy resin composition for prepreg, prepreg and multilayered printed wiring board

Motobe et al of Matsushita Electric Works, Japan, developed an epoxy resin for a prepreg used in manufacturing a printed wiring board, particularly a multilayered printed wiring board.  The composition features a multifunctional epoxy resin having on average 2.8 or more epoxy groups per molecule; a reaction product of a phosphorous compound, an bifunctional epoxy resin, and an optional multifunctional epoxy resin, provided in an amount of 20% to 55% by mass, based on the total amount of epoxy resin, including a curing agent of dicyandiamide and/or a multifunctional phenolic compound; and (D) an inorganic filler blend containing an inorganic filler with a thermal decomposition temperature of 400.degree. C. or above.. (RDC 11/30/2011)

3. 8,062,468
Low-temperature impact resistant thermosetting epoxide resin compositions with solid epoxide resins

Finter et al of Sika Technology, Switzerland, developed a low temperature adhesive consisting of a solid epoxide resin, a polyurethane), a urea  thixotropic agent and curing agent activated by high temperatures.  (RDC 11/29/2011)

2. 8,062,455
Composition comprising benzoxazine and epoxy resin

Tseui of Huntsman, Texas, developed a benzoxazine resin and a resin based on bisphenol A diglycidyl ether and bisphenol S with ferrocene and aluminium trihydrate. Such compositions are, when cured to form polymeric networks, difficultly inflammable and resistant to high temperatures. Such compositions may especially be used in the production of printed wiring boards. (RDC 11/29/2011)

1. 8,058,362
Manufacture of novel epoxy resins semi-thermosets and their high TG thermosets for electronic applications

Lin, Hu and Lin of National Chung Hsing University, Taiwan, developed an active-hydrogen-containing (carboxyl or hydroxyl) phosphorus compound.  An epoxy resin semi-thermoset formed by bonding the phosphorus compound to an epoxy group is also provided. A flame-retardant epoxy resin thermoset is formed after reacting the epoxy resin semi-thermoset with a curing agent. The epoxy resin thermoset possesses excellent flame retardancy, heat stability, and high glass transition temperature (Tg), does not produce toxic and corrosive fumes during combustion, and thus is an environmentally friendly flame-retardant material.  (RDC 11/18/2011)

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Roger D. Corneliussen
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Copyright 2012 by Roger D. Corneliussen.
No part of this transmission is to be duplicated in any manner or forwarded by electronic mail without the express written permission of Roger D. Corneliussen
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** Date of latest addition; date of first entry is 5/3/2012.