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Heat Pipes

Patents with Abstracts

*5/10/2012

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Patents with Abstracts

8,136,583 
Method for providing an optimum heat exchange within an assemby consisting of a heat-conducting absorbing plate and a heat transfer fluid

Vilmart and Vilmart, France, optiomized heat exchanges between (i) a thermally-conductive absorbent plate (1) which is exposed to thermal radiation and a heat-transfer fluid (3) circulating in at least one thermally-conductive conduit tube (2) that is in thermal contact with the plate (1) and (ii) within the heat-transfer fluid (3). The invention is characterized in that, in order to promote heat exchanges, the method uses zones of the aforementioned plate (1) in order to form part of the wall of the conduit tube (2), such that the heat-transfer fluid (3) is in direct contact with the plate (1) so as to reduce the thermal resistance between the plate (1) and the heat-transfer fluid (3) circulating inside the conduit tube (2), said conduit tubes (2) being disposed on the two faces of the plate (1) and being interconnected by means of holes (4) that provided on the plate. (RDC 5/10/2012)

8,136,582 
Water vaporizer with intermediate steam superheating pass
 
Valensa, Reinke and Meissner of Modine Manufacturing, Wisconsin, developed a vaporizing heat exchanger for vaporizing a fluid flow using a thermal energy containing flow.  Flow paths for each of the fluid flow and the thermal energy containing flow are located relative to each other such that the fluid flow makes multiple passes wherein the fluid is vaporized and subsequently superheated.  (RDC 5/10/2012)

8,136,581 
Heat transport apparatus and heat transport apparatus manufacturing method
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Tonosaki et al of Sony, Japan, has developed a heat transport device having a composite structure that is readily manufactured.  This  includes a first base plate having a liquid suction and retention unit for sucking and retaining a liquid-phase working fluid by capillary force; a second base plate having a face provided with a first concavity functioning as a vaporization chamber for vaporizing the working fluid, a second concavity functioning as a liquefaction chamber for liquefying the working fluid, a first ditch for transporting the vaporized working fluid, a second ditch for transporting the liquefied working fluid, the second base plate comprising a material having a thermal conductivity lower than that of silicon; and a thermoplastic or thermosetting resin material for bonding the first and second base plates. The heat transport device can be readily manufactured by heating the first and second base plates sandwiching a thermoplastic or thermosetting resin material therebetween. (RDC 5/10/2012)

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Roger D. Corneliussen
Editor
www.maropolymeronline.com

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Tel: 610 363 9920
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E-Mail: cornelrd@bee.net  

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Copyright 2012 by Roger D. Corneliussen.
No part of this transmission is to be duplicated in any manner or forwarded by electronic mail without the express written permission of Roger D. Corneliussen
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** Date of latest addition; date of first entry is 5/10/2012.