Maro Publications

Thermally Conductive Materials

Patents with Abstracts

*7/26/2012

Maro Topics

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Patents with Abstracts

8,216,672 
Structured resin systems with high thermal conductivity fillers
 
Smith, Stevens and Wood of Siemens Energy, Inc., Florida, developed a high thermal conductivity highly structured resin that comprises a host highly structured resin matrix, and a high thermal conductivity filler. The high thermal conductivity fillers are from 1-1000 nm in length, and high thermal conductivity fillers have an aspect ratio of between 3-100. Particular highly structured highly structured resins include at least one of liquid crystal 40 polymers, interpenetrating networks, dendrimer type matrices. expanding polymers, ladder polymers, star polymers and structured organic-inorganic hybrids (RDC 7/26/2012)

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Interested!!
Bookmark this page to follow future developments!.
(RDC 6/5/2012)

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Roger D. Corneliussen
Editor
www.maropolymeronline.com

Maro Polymer Links
Tel: 610 363 9920
Fax: 610 363 9921
E-Mail: cornelrd@bee.net  

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Copyright 2012 by Roger D. Corneliussen.
No part of this transmission is to be duplicated in any manner or forwarded by electronic mail without the express written permission of Roger D. Corneliussen
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** Date of latest addition; date of first entry is 7/26/2012.