Maro Publications

Vibration Control

Patent Abstracts

*4/23/2013 
from 4/20/2013

Maro Topics

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Patent Abstracts

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1. 8,404,310 
Thermoset dampener material 

Dampener materials commonly used in the transportation and aerospace industry include rubber materials, bituminous pads, and other similar materials. These materials are typically only effective at dampening vibrations at low temperatures, most often at room temperature.  However, parts used in the transportation and aerospace industry are often subjected to mechanical vibrations at high temperatures. In particular, vibration dampening at temperatures in excess of 150.degree. C. is very difficult to achieve.   There exists a need for thermoset compositions useful for vibration dampening at elevated temperatures. As illustrated by the following references, there exists various materials having high glass transition temperatures or that are stable at high temperatures.

Rousse and  Valette of Dow, Michigan,  developed thermoset compositions useful for dampening vibrations at elevated temperatures are disclosed.  The thermoset compositions may have a glass transition temperature of 150 C or greater, a tan .delta. peak of 0.2 or greater, and a tan .delta. peak width measured at half-height larger than about 400 C., each as measured by dynamic mechanical thermal analysis (DMTA) at a frequency of 1 Hz.  The thermoset compositions may be used to dampen vibrations at temperatures in excess of 100  C.  Candidate resins include epoxy resins, phenolic resins or resins capable of generating phenolic groups at high temperature, vinylic resins, cycloaliphatic epoxy resins and nitrogen containing resins such as cyanate ester based resins. 

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Interested!!
Bookmark this page to follow future developments!.
(RDC 6/5/2012)

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Roger D. Corneliussen
Editor
www.maropolymeronline.com

Maro Polymer Links
Tel: 610 363 9920
Fax: 610 363 9921
E-Mail: cornelrd@bee.net  

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Copyright 2013 by Roger D. Corneliussen.
No part of this transmission is to be duplicated in any manner or forwarded by electronic mail without the express written permission of Roger D. Corneliussen
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** Date of latest addition; date of first entry is 4/20/2013.